Mumbai:
IBM will unveil the prototype of the fastest-ever
chipset this week at the 2007 Optical Fibre Conference.
The optical transceiver chipset is capable of reaching
speeds at least eight times faster than optical components
available today, IBM said.
The
chipset is capable of moving information at speeds of
160 Gigabits per second by using light pulses to speed
the flow of data, instead of sending electrons over wires.
The
transceiver could reduce download time for a typical high
definition feature-length film to a single second compared
to 30 minutes or more.
The
technology could also be integrated onto printed circuit
boards to allow the components within an electronic system
such as a PC or set top box to communicate
much faster, dramatically enhancing the performance of
the system itself, IBM said.
IBM
researchers said the high level of integration in the
chipset has been achieved by using the same high-volume,
low-cost CMOS technology used for most chips.
They
have then been coupled with other necessary optical components
made of more exotic materials, such as indium phosphide
(InP) and gallium arsenide (GaAs), into one, integrated
package only 3.25 by 5.25 millimeters in size.
The
compact design provides a high number of communication
channels as well as very high speeds per channel, resulting
in the highest-ever transmission of information per unit
area of card space taken up by the
This
transceiver chipset is designed to enable low-cost optics
by attaching to an optical printed circuit board employing
densely spaced polymer waveguide channels using mass assembly
processes.
"The
explosion in the amount of data being transferred, when
downloading movies, TV shows, music or photos, is creating
demand for greater bandwidth and higher speeds in connectivity,"
said T C Chen, vice president, science and technology,
IBM Research.
"Greater
use of optical communications is needed to address this
issue. We believe our optical transceiver technology may
provide the answer," he added.
The
research was partially funded by Defence Advanced Research
Project Agency (DARPA) through the ''chip to chip optical
interconnect (C2OI) programme.
|